DOD Contract : FA810305C0132 | FA8103-05-C-0132

There are 52 government contract actions against this contract, with quantities ranging from 1 and 3,463. Execution of this contract spans from June 6, 2005 and December 12, 2005. The procuring agency is 5700: AIR FORCE, Department of the (Headquarters, USAF).

It has been awarded to HONEYWELL INTERNATIONAL INC located in , NM.

The item name for this contract is: MICROCIRCUIT,HYBRID.

Back to Agency ListRecent contract actions
DOD ContractsDelivery OrderLine ItemQuantityPriceAgencyAward Date
fa810305c0132P000020015AAFree Trial5700: AIR FORCE, Department of the (Head2005-12-13
fa810305c0132P000020018AAFree Trial5700: AIR FORCE, Department of the (Head2005-12-13
fa810305c0132P000020016AAFree Trial5700: AIR FORCE, Department of the (Head2005-12-13
fa810305c0132P000020014AAFree Trial5700: AIR FORCE, Department of the (Head2005-12-13
fa810305c0132P000020025AAFree Trial5700: AIR FORCE, Department of the (Head2005-12-13
fa810305c0132P000020017AAFree Trial5700: AIR FORCE, Department of the (Head2005-12-13
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Federal Supply Classes for FA810305C0132

5962 - Microcircuits, Electronic

Includes: Includes Integrated Circuit Devices; Integrated Circuit Modules, Integrated Electronic Devices: Hybrid, Magnetic, Molecular, Opto-Electronic, and Thin Film.

Excludes: Excludes Single Circuit Elements such as Capacitors; Resistors; Diodes and Transistors; Printed Circuit Boards and Circuit Card Assemblies; and Filters and Networks.

Note: Note-(1) A microcircuit is defined as follows: A small circuit having a high equivalent circuit element density, which is considered as a single part composed of interconnected elements placed and/or formed on or within a single substrate to perform an electronic circuit function. The elements may be formed on or within a semiconductor material substrate; may consist of conductive film(s) formed on an insulating substrate; or may be a combination of one or both of these types with discrete elements. (2) The term "microcircuit", as applied to circuit devices included in this class, is delimited to exclude items consisting solely of interconnected "microcomponents" (discrete miniaturized components). Also excluded are items fabricated in the form of monolithic thick-film or thin-film structures that in themselves are not functional electronic circuits (e.g., Capacitors, Resistors, Transistors, or "arrays" thereof).

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