DOD Contract : FA811709C0003 | FA8117-09-C-0003
There are 10 government contract actions against this contract, with quantities ranging from 10 and 25. Execution of this contract spans from December 12, 2008 and December 12, 2008. The procuring agency is 5700: AIR FORCE, Department of the (Headquarters, USAF).
It has been awarded to HONEYWELL INTERNATIONAL INC. located in , NM.
The item name for this contract is: MICROCIRCUIT,HYBRID.
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| DOD Contracts | Delivery Order | Line Item | Quantity | Price | Agency | Award Date | fa811709c0003 | 0001 | Free Trial | 5700: AIR FORCE, Department of the (Head | 2008-12-30 | fa811709c0003 | 0002 | Free Trial | 5700: AIR FORCE, Department of the (Head | 2008-12-30 | fa811709c0003 | 0003 | Free Trial | 5700: AIR FORCE, Department of the (Head | 2008-12-30 | fa811709c0003 | 0004 | Free Trial | 5700: AIR FORCE, Department of the (Head | 2008-12-30 | fa811709c0003 | 0005 | Free Trial | 5700: AIR FORCE, Department of the (Head | 2008-12-30 | fa811709c0003 | 0006 | Free Trial | 5700: AIR FORCE, Department of the (Head | 2008-12-30 |
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Federal Supply Classes for FA811709C0003
5962 - Microcircuits, Electronic
Includes: Includes Integrated Circuit Devices; Integrated Circuit Modules, Integrated Electronic Devices: Hybrid, Magnetic, Molecular, Opto-Electronic, and Thin Film.
Excludes: Excludes Single Circuit Elements such as Capacitors; Resistors; Diodes and Transistors; Printed Circuit Boards and Circuit Card Assemblies; and Filters and Networks.
Note: Note-(1) A microcircuit is defined as follows: A small circuit having a high equivalent circuit element density, which is considered as a single part composed of interconnected elements placed and/or formed on or within a single substrate to perform an electronic circuit function. The elements may be formed on or within a semiconductor material substrate; may consist of conductive film(s) formed on an insulating substrate; or may be a combination of one or both of these types with discrete elements. (2) The term "microcircuit", as applied to circuit devices included in this class, is delimited to exclude items consisting solely of interconnected "microcomponents" (discrete miniaturized components). Also excluded are items fabricated in the form of monolithic thick-film or thin-film structures that in themselves are not functional electronic circuits (e.g., Capacitors, Resistors, Transistors, or "arrays" thereof).