DOD Contract : SPM7AZ06G0003 | SPM7AZ-06-G-0003

There are 3 government contract actions against this contract. The procuring agency is The Defense Logistics Agency.

It has been awarded to located in , .

This contract includes procurement for MICROCIRCUIT,MEMORY and VALVE CUTOFF.

Back to Agency ListRecent contract actions
DOD ContractsDelivery OrderLine ItemQuantityPriceAgencyAward Date
spm7az06g0003Z1B40001Free TrialThe Defense Logistics Agency2011-09-23
spm7az06g0003TYJC0001Free TrialThe Defense Logistics Agency2009-09-22
spm7az06g0003TYJC0002Free TrialThe Defense Logistics Agency2009-09-22
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Federal Supply Classes for SPM7AZ06G0003

2915 - Engine Fuel System Components, Aircraft and Missile Prime Movers

Includes: Includes Carburetors; Fuel Pumps; Engine Fuel Filters; Fuel Controls, Jet Engine; Fuel Primers; Water Injection Controls and Valves; Fuel Valves Fuel Flow Regulators; Components of Smoke Abatement Systems.

Excludes: Excludes Aircraft Fuel Tanks (FSC 1560); In-flight Refueling System Fuel Components (FSC 1680). Fuel System Components not specifically designed for use with Aircraft Engines or Missile Prime-movers.

Note: Note-Fuel components specially designed for propulsion fuel systems, aircraft and missiles are to be placed in this FSC.

5962 - Microcircuits, Electronic

Includes: Includes Integrated Circuit Devices; Integrated Circuit Modules, Integrated Electronic Devices: Hybrid, Magnetic, Molecular, Opto-Electronic, and Thin Film.

Excludes: Excludes Single Circuit Elements such as Capacitors; Resistors; Diodes and Transistors; Printed Circuit Boards and Circuit Card Assemblies; and Filters and Networks.

Note: Note-(1) A microcircuit is defined as follows: A small circuit having a high equivalent circuit element density, which is considered as a single part composed of interconnected elements placed and/or formed on or within a single substrate to perform an electronic circuit function. The elements may be formed on or within a semiconductor material substrate; may consist of conductive film(s) formed on an insulating substrate; or may be a combination of one or both of these types with discrete elements. (2) The term "microcircuit", as applied to circuit devices included in this class, is delimited to exclude items consisting solely of interconnected "microcomponents" (discrete miniaturized components). Also excluded are items fabricated in the form of monolithic thick-film or thin-film structures that in themselves are not functional electronic circuits (e.g., Capacitors, Resistors, Transistors, or "arrays" thereof).

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